ALPHA® AccuFlux® BTC-578 technology is a precision controlled micro-flux coating on solder preforms. The chemistry was designed specifically to produce lower void results at the thermal/ground interface of Bottom Terminated Component packages such as QFN, QFP, and D-Pak.
Incorporating ALPHA® AccuFlux® BTC-578 flux coated preforms and solder paste with an optimized stencil design results in minimal to non-detectable flux residues, meeting the most demanding electro-chemical reliability requirements. This technology can easily be implemented into an existing SMT circuit assembly process.
