ALPHA HiTech EN31-4007B is a one-component epoxy system designed to improve the attachment strength of solder joints by encapsulating the material over the chip component.
ALPHA HiTech EN31-4007B's excellent flexibility allows it to dynamically flex in tandem with components and prevent cracking, especially in FPCB assembly process.
This product has been tested to provide excellent Adhesion on FR4, Flexible Polyimide (FPC) and PET substrates.
Users also have the option to rework as required since the product is highly reworkable.
