ALPHA HiTech CU31-2030 Underfill is a one-component capillary underfill designed for the protection of assembled chip packages on printed circuit boards.
ALPHA HiTech CU31-2030's low viscosity characteristic enables fast and efficient flow properties at room temperature. Its high Tg and low modulus properties enables excellent reliability performance.
ALPHA HiTech CU31-2030 is suitable for assembling BGA, CSP and Flip Chip devices. All ALPHA HiTech products are halogen-free.
