ALPHA® HiTech CU13-3150 Underfill is a one-component, low temp thermal cure capillary underfill designed for low temperature applications requiring enhanced mechanical strength for chip packages assembled on printed circuit boards.
Its low viscosity property is excellent for BGA application, thus no preheat is required during the dispensing process.
This adhesive is an excellent option for processes requiring curing temperature as low as 80°C.
