ALPHA® HiTech CU11-3127 Underfill is a one-component capillary underfill for protecting assembled chip packages on printed circuit boards. Its high Tg, low CTE properties protects the solder joints from mechanical stresses.
ALPHA HiTech CU11-3127 has a unique low viscosity property, making it possible to secure full coverage flow at room temperature without preheat. For a faster flow rate, preheat of < 80°C is recommended on substrates during dispensing process.
