ALPHA HiTech CF31-4010 is a one component, high filler content, heat curable Edgebond designed to be dispensed on the corners (corner bonding) or edges (edge bonding) of BGA devices.
(edge bonding) of BGA devices.
Upon completion of the curing process, the cured edgebond helps to strengthen the soldered assembled component allowing it to pass reliability tests such as Drop Shock, Impact Bend and Thermal Cycle (TCT).
A lower cost option to conventional underfilling process with increased productivity and lower material volume required.
All ALPHA HiTech Products are halogen-Free.
