A one component, heat curable material to be dispensed on the corners of the BGA.
The cured edgebond will help to strengthen the soldered assembled components.
A lower cost option to conventional underfilling process with increased productivity and lower material volume required.
ALPHA HiTech CF12-4485B end market is in portables such as Graphic Cards, Notebooks, Tablets, as well as assembled boards in Automotive and Medical accessories.
It can be stored in non-freezing condition of 1 - 10°C.
