HiTech

ALPHA HiTech Adhesives & Encapsulants offer a full line of high performance adhesive and encapsulant materials. Designed for a wide range of applications including Automotive, Camera Modules, Mobile, Computing, White Goods Assemblies and LED assemblies.

ALPHA HiTech Edgebond is a one component, heat curable epoxy that is dispensed on the corners of the BGA. The cured Edgebond will help to strengthen the soldered assembled component so it can pass reliability tests such as Drop Shock, Impact Bend and Thermal Cycle (TCT).

ALPHA HiTech Underfills are one component, heat curable materials. The materials have been optimized for capillary underfill and reworkability. These epoxy based materials can be dispensed on the edges of the BGA, CSP or Flip Chip devices. This material will subsequently flow to fill the space beneath these components.