ALPHA EF-6000 is an active, rosin-free, low solid, low residue no-clean flux. With a wide thermal process window, it delivers good hole-fill across different preheating temperatures and dwell times.
Several proprietary additives are formulated into ALPHA EF-6000 to reduce the surface tension between the solder mask and the solder; thereby, dramatically reducing the tendency of solder ball generation. The formulation of ALPHA EF-6000 is also more thermally stable, for lower occurrence of solder bridging during dual wave soldering.
ALPHA EF-6000 has been designed for lower resistant residues to minimize the impact to electrical frequencies by no-clean flux residues. The minimal residues also offer better pin testability and cosmetic appearance.
