ALPHA® RF-800 provides the broadest process window for a no-clean flux with less than 5% solids content. ALPHA® RF-800 is designed to provide excellent soldering results (low defects rates), even when the surfaces to be soldered (component leads and pads) are not highly solderable. ALPHA® RF-800 works particularly well with bare copper boards protected with organic or rosin/resin coatings and with tin-lead coated PCB's. ALPHA® RF-800 is used successfully in both tin-lead and lead-free applications.
