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ALPHA HiTech Adhesives & Encapsulants offer a full line of high performance adhesive and encapsulant materials. Designed for a wide range of applications including Automotive, Camera Modules, Mobile, Computing, White Goods Assemblies and LED assemblies.<\/p>\n ALPHA HiTech Edgebond is a one component, heat curable epoxy that is dispensed on the corners of the BGA. The cured Edgebond will help to strengthen the soldered assembled component so it can pass reliability tests such as Drop Shock, Impact Bend and Thermal Cycle (TCT).<\/p>\n ALPHA HiTech Underfills are one component, heat curable materials. The materials have been optimized for capillary underfill and reworkability. These epoxy based materials can be dispensed on the edges of the BGA, CSP or Flip Chip devices. 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custom_padding__hover=”|||”][\/et_pb_column][\/et_pb_row][\/et_pb_section]<\/p>","protected":false},"excerpt":{"rendered":" HiTechALPHA HiTech Adesivos e Encapsulantes oferece uma linha completa de alto desempenho de adesivos e materiais encapsulantes. Concebidos para uma vasta gama de aplica\u00e7\u00f5es, incluindo Autom\u00f3vel, M\u00f3dulos de C\u00e2mara, M\u00f3vel, Inform\u00e1tica, Montagens de Produtos Brancos e Montagens LED. ALPHA HiTech Edgebond s\u00e3o materiais de um s\u00f3 componente, de epoxi cur\u00e1vel por calor que \u00e9 dispensado nos cantos do BGA. O Edgebond curado ajudar\u00e1 a refor\u00e7ar o componente soldado montado para que possa passar nos testes de fiabilidade tais como Choque de Queda, Dobra de Impacto e Ciclo T\u00e9rmico (TCT). ALPHA HiTech Underfills s\u00e3o materiais de um s\u00f3 componente, termo-cur\u00e1veis. Os materiais foram otimizados para o subenchimento capilar e a possibilidade de retrabalho. Estes materiais \u00e0 base de epoxi podem ser dispensados nos bordos dos dispositivos BGA, CSP ou Flip Chip. Este material flui para preencher o espa\u00e7o por baixo destes componentes.Contacte-nos para mais informa\u00e7\u00f5es.<\/p>","protected":false},"author":1,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_et_pb_use_builder":"on","_et_pb_old_content":"","_et_gb_content_width":"","footnotes":""},"class_list":["post-136","page","type-page","status-publish","hentry"],"_links":{"self":[{"href":"https:\/\/produtronica.com\/en\/wp-json\/wp\/v2\/pages\/136","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/produtronica.com\/en\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/produtronica.com\/en\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/produtronica.com\/en\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/produtronica.com\/en\/wp-json\/wp\/v2\/comments?post=136"}],"version-history":[{"count":3,"href":"https:\/\/produtronica.com\/en\/wp-json\/wp\/v2\/pages\/136\/revisions"}],"predecessor-version":[{"id":1142,"href":"https:\/\/produtronica.com\/en\/wp-json\/wp\/v2\/pages\/136\/revisions\/1142"}],"wp:attachment":[{"href":"https:\/\/produtronica.com\/en\/wp-json\/wp\/v2\/media?parent=136"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}Please contact us for further information.<\/span><\/h2>\n