{"id":260,"date":"2023-01-03T22:01:30","date_gmt":"2023-01-03T22:01:30","guid":{"rendered":"https:\/\/produtronica.gr-alfa.com\/?post_type=project&#038;p=260"},"modified":"2023-11-21T21:31:34","modified_gmt":"2023-11-21T21:31:34","slug":"solda-em-pasta-alpha-om-565-hrl3","status":"publish","type":"project","link":"https:\/\/produtronica.com\/en\/project\/solda-em-pasta-alpha-om-565-hrl3\/","title":{"rendered":"ALPHA\u00ae OM-565 HRL3 Solder Paste"},"content":{"rendered":"<p class=\"wp-block-paragraph\">ALPHA\u00ae OM-565 HRL3 low temperature solder paste is designed to mitigate warpage induced defects in temperature sensitive chip-scale packages. The solder paste enables peak reflow temperatures of 175 \u00b0C and superior wettability to minimize post reflow defects such as Non-Wet-Open (NWO) and Head-in-Pillow (HIP).<br>The ALPHA\u00ae OM-565 chemistry enhances electrochemical performance over existing low melt point solders and provides excellent compatibility when used in combination with alternative ALPHA solutions for contact rework applications.<\/p>","protected":false},"excerpt":{"rendered":"<p>A low temperature lead-free alloy designed to exhibit improved thermomechanical reliability and soldering performance versus existing low temperature alloys in the market.<\/p>\n<p>Low temperature enabling in selective and dip soldering processes.<br \/>\nProvides efficiencies in energy savings and reduces thermal damage.<br \/>\nComparable hole fill performance and solder joint strength vs SAC305.<br \/>\nVIEW PRODUCT DETAILS<\/p>","protected":false},"author":1,"featured_media":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_et_pb_use_builder":"off","_et_pb_old_content":"<!-- wp:paragraph -->\n<p>ALPHA OM-565 is a zero-halogen, low temperature flux chemistry, developed specifically for the HRL3 alloy to enable target peak reflow of 175 \u00b0C for minimized warpage induced defects and enhanced product reliability compared to existing low temperature solutions.<\/p>\n<!-- \/wp:paragraph -->\n\n<!-- wp:list -->\n<ul><!-- wp:list-item -->\n<li>Compatibility with HRL3 alloy for enhanced thermomechanical and drop shock reliability.<\/li>\n<!-- \/wp:list-item -->\n\n<!-- wp:list-item -->\n<li>The HRL3 alloy enables peak reflow temperature of 175 \u00b0C to mitigate warpage induced defects.&nbsp;<\/li>\n<!-- \/wp:list-item -->\n\n<!-- wp:list-item -->\n<li>Low melt point reflow improves energy efficiency and reduces energy costs in the assembly process.&nbsp;<\/li>\n<!-- \/wp:list-item --><\/ul>\n<!-- \/wp:list -->","_et_gb_content_width":"","footnotes":""},"project_category":[11],"project_tag":[],"class_list":["post-260","project","type-project","status-publish","hentry","project_category-sem-chumbo-baixa-temperatura"],"_links":{"self":[{"href":"https:\/\/produtronica.com\/en\/wp-json\/wp\/v2\/project\/260","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/produtronica.com\/en\/wp-json\/wp\/v2\/project"}],"about":[{"href":"https:\/\/produtronica.com\/en\/wp-json\/wp\/v2\/types\/project"}],"author":[{"embeddable":true,"href":"https:\/\/produtronica.com\/en\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/produtronica.com\/en\/wp-json\/wp\/v2\/comments?post=260"}],"version-history":[{"count":3,"href":"https:\/\/produtronica.com\/en\/wp-json\/wp\/v2\/project\/260\/revisions"}],"predecessor-version":[{"id":1233,"href":"https:\/\/produtronica.com\/en\/wp-json\/wp\/v2\/project\/260\/revisions\/1233"}],"wp:attachment":[{"href":"https:\/\/produtronica.com\/en\/wp-json\/wp\/v2\/media?parent=260"}],"wp:term":[{"taxonomy":"project_category","embeddable":true,"href":"https:\/\/produtronica.com\/en\/wp-json\/wp\/v2\/project_category?post=260"},{"taxonomy":"project_tag","embeddable":true,"href":"https:\/\/produtronica.com\/en\/wp-json\/wp\/v2\/project_tag?post=260"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}