{"id":296,"date":"2023-01-16T19:21:48","date_gmt":"2023-01-16T19:21:48","guid":{"rendered":"https:\/\/produtronica.gr-alfa.com\/?post_type=project&p=296"},"modified":"2023-08-09T16:05:40","modified_gmt":"2023-08-09T16:05:40","slug":"solda-em-pasta-alpha-cvp-520","status":"publish","type":"project","link":"https:\/\/produtronica.com\/en\/project\/solda-em-pasta-alpha-cvp-520\/","title":{"rendered":"ALPHA\u00ae CVP-520 Solder Paste"},"content":{"rendered":"

ALPHA CVP-520 is designed for near eutetic low temperature alloys such as SnBi0.4Ag to enable peak reflow profiles between 155\u00b0C and 190\u00b0C. The flux residue is clear, colorless, and provides excellent electrochemical reliability.
The carefully selected alloy in ALPHA CVP-520 offers the lowest melting point, lowest pasty range during melting and re-solidification, offering maximum resistance to thermal cycle based fatigue in traditional low temperature alloy applications. The alloy also yields very low voiding BGA solder joints, even when a traditional SAC alloy sphere is used.
All components used with SnBi solders must be lead-free to eliminate the formation of tin\/lead\/bismuth intermetallic which has a melting point under 100\u00b0C.<\/p>\n\n\n\n

Click here to see technical bulletin<\/a><\/strong><\/p>","protected":false},"excerpt":{"rendered":"

ALPHA CVP-520 foi concebida para ligas quase eut\u00e9ticas de baixa temperatura, tais como SnBi0.4Ag para permitir perfis de pico de reflow entre 155\u00b0C e 190\u00b0C. O res\u00edduo de fluxo \u00e9 claro, incolor, e proporciona uma excelente fiabilidade electroqu\u00edmica.A liga cuidadosamente selecionada em ALPHA CVP-520 oferece o ponto de fus\u00e3o mais baixo, a gama pastosa mais baixa durante a fus\u00e3o e a re-solidifica\u00e7\u00e3o, oferecendo a m\u00e1xima resist\u00eancia \u00e0 fadiga de ciclo t\u00e9rmico em aplica\u00e7\u00f5es tradicionais de ligas a baixa temperatura. A liga tamb\u00e9m produz juntas de solda BGA com muito baixo n\u00edvel de voids, mesmo quando \u00e9 utilizada uma esfera de liga SAC tradicional.Todos os componentes utilizados com soldas SnBi devem ser isentos de chumbo para eliminar a forma\u00e7\u00e3o de estanho\/chumbo\/bismuto intermet\u00e1lico que tem um ponto de fus\u00e3o inferior a 100\u00b0C. Clique aqui para consultar a ficha t\u00e9cnica do produto<\/p>","protected":false},"author":1,"featured_media":0,"comment_status":"open","ping_status":"closed","template":"","meta":{"_et_pb_use_builder":"","_et_pb_old_content":"","_et_gb_content_width":"","footnotes":""},"project_category":[11],"project_tag":[],"class_list":["post-296","project","type-project","status-publish","hentry","project_category-sem-chumbo-baixa-temperatura"],"_links":{"self":[{"href":"https:\/\/produtronica.com\/en\/wp-json\/wp\/v2\/project\/296","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/produtronica.com\/en\/wp-json\/wp\/v2\/project"}],"about":[{"href":"https:\/\/produtronica.com\/en\/wp-json\/wp\/v2\/types\/project"}],"author":[{"embeddable":true,"href":"https:\/\/produtronica.com\/en\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/produtronica.com\/en\/wp-json\/wp\/v2\/comments?post=296"}],"version-history":[{"count":2,"href":"https:\/\/produtronica.com\/en\/wp-json\/wp\/v2\/project\/296\/revisions"}],"predecessor-version":[{"id":1150,"href":"https:\/\/produtronica.com\/en\/wp-json\/wp\/v2\/project\/296\/revisions\/1150"}],"wp:attachment":[{"href":"https:\/\/produtronica.com\/en\/wp-json\/wp\/v2\/media?parent=296"}],"wp:term":[{"taxonomy":"project_category","embeddable":true,"href":"https:\/\/produtronica.com\/en\/wp-json\/wp\/v2\/project_category?post=296"},{"taxonomy":"project_tag","embeddable":true,"href":"https:\/\/produtronica.com\/en\/wp-json\/wp\/v2\/project_tag?post=296"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}