{"id":339,"date":"2023-01-25T20:10:58","date_gmt":"2023-01-25T20:10:58","guid":{"rendered":"https:\/\/produtronica.gr-alfa.com\/?post_type=project&#038;p=339"},"modified":"2023-09-05T21:02:07","modified_gmt":"2023-09-05T21:02:07","slug":"solda-em-preform-alpha-accuflux-btc-578","status":"publish","type":"project","link":"https:\/\/produtronica.com\/en\/project\/solda-em-preform-alpha-accuflux-btc-578\/","title":{"rendered":"ALPHA\u00ae AccuFlux\u00ae BTC-578 Solder Preforms"},"content":{"rendered":"<p>ALPHA\u00ae AccuFlux\u00ae BTC-578 technology is a precision controlled micro-flux coating on solder preforms. The chemistry was designed specifically to produce lower void results at the thermal\/ground interface of Bottom Terminated Component packages such as QFN, QFP, and D-Pak.<br>Incorporating ALPHA\u00ae AccuFlux\u00ae BTC-578 flux coated preforms and solder paste with an optimized stencil design results in minimal to non-detectable flux residues, meeting the most demanding electro-chemical reliability requirements. This technology can easily be implemented into an existing SMT circuit assembly process.<\/p>\n\n\n\n<p><strong><strong><a href=\"https:\/\/produtronica.com\/wp-content\/uploads\/2023\/03\/ALPHA-AccuFlux-BTC-578-Preform-EN-14Jan21-TB.pdf\" target=\"_blank\" rel=\"noreferrer noopener\">Click here to see technical bulletin<\/a><\/strong><\/strong><\/p>","protected":false},"excerpt":{"rendered":"<p>A tecnologia ALPHA\u00ae AccuFlux\u00ae BTC-578 permite que a solda em preform seja revestida com microfluxo num processo controlado com precis\u00e3o. A qu\u00edmica foi desenvolvida especificamente para produzir menos voids na interface thermal\/ground dos Bottom Terminated Component packages tais como QFN, QFP e D-Pak.Aliando a solda em preforms ALPHA\u00ae AccuFlux\u00ae BTC-578 revestida de fluxo e a solda em pasta com um design de stencil optimizado obt\u00eam-se res\u00edduos de fluxo m\u00ednimos ou mesmo n\u00e3o detect\u00e1veis, satisfazendo os requisitos de fiabilidade eletroqu\u00edmica mais exigentes. Esta tecnologia pode ser facilmente implementada num processo de montagem de circuitos SMT j\u00e1 existente. Clique aqui para consultar a ficha t\u00e9cnica do produto<\/p>","protected":false},"author":1,"featured_media":0,"comment_status":"open","ping_status":"closed","template":"","meta":{"_et_pb_use_builder":"","_et_pb_old_content":"","_et_gb_content_width":"","footnotes":""},"project_category":[39],"project_tag":[],"class_list":["post-339","project","type-project","status-publish","hentry","project_category-montagem-de-pcb"],"_links":{"self":[{"href":"https:\/\/produtronica.com\/en\/wp-json\/wp\/v2\/project\/339","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/produtronica.com\/en\/wp-json\/wp\/v2\/project"}],"about":[{"href":"https:\/\/produtronica.com\/en\/wp-json\/wp\/v2\/types\/project"}],"author":[{"embeddable":true,"href":"https:\/\/produtronica.com\/en\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/produtronica.com\/en\/wp-json\/wp\/v2\/comments?post=339"}],"version-history":[{"count":2,"href":"https:\/\/produtronica.com\/en\/wp-json\/wp\/v2\/project\/339\/revisions"}],"predecessor-version":[{"id":1188,"href":"https:\/\/produtronica.com\/en\/wp-json\/wp\/v2\/project\/339\/revisions\/1188"}],"wp:attachment":[{"href":"https:\/\/produtronica.com\/en\/wp-json\/wp\/v2\/media?parent=339"}],"wp:term":[{"taxonomy":"project_category","embeddable":true,"href":"https:\/\/produtronica.com\/en\/wp-json\/wp\/v2\/project_category?post=339"},{"taxonomy":"project_tag","embeddable":true,"href":"https:\/\/produtronica.com\/en\/wp-json\/wp\/v2\/project_tag?post=339"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}