{"id":439,"date":"2023-03-06T17:23:39","date_gmt":"2023-03-06T17:23:39","guid":{"rendered":"https:\/\/produtronica.com\/?post_type=project&#038;p=439"},"modified":"2023-07-04T23:12:46","modified_gmt":"2023-07-04T23:12:46","slug":"alpha-hitech-cu13-3150-underfill","status":"publish","type":"project","link":"https:\/\/produtronica.com\/en\/project\/alpha-hitech-cu13-3150-underfill\/","title":{"rendered":"ALPHA\u00ae HiTech CU13-3150 Underfill"},"content":{"rendered":"<p>ALPHA\u00ae HiTech CU13-3150 Underfill is a one-component, low temp thermal cure capillary underfill designed for low temperature applications requiring enhanced mechanical strength for chip packages assembled on printed circuit boards.<br>Its low viscosity property is excellent for BGA application, thus no preheat is required during the dispensing process.<br>This adhesive is an excellent option for processes requiring curing temperature as low as 80\u00b0C.<\/p>\n\n\n\n<p><strong><a href=\"https:\/\/produtronica.com\/wp-content\/uploads\/2023\/03\/ALPHA-HiTech-CU13-3150-Adhesive-EN-14Sep20-TB.pdf\" data-type=\"URL\" target=\"_blank\" rel=\"noreferrer noopener\">Click here to see technical bulletin<\/a><\/strong><\/p>","protected":false},"excerpt":{"rendered":"<p>ALPHA\u00ae HiTech CU13-3150 Underfill \u00e9 um subenchimento capilar de cura t\u00e9rmica a baixa temperatura de um s\u00f3 componente concebido para aplica\u00e7\u00f5es a baixa temperatura que requerem uma maior resist\u00eancia mec\u00e2nica para pacotes de chips montados em placas de circuitos impressos.A sua baixa viscosidade \u00e9 excelente para a aplica\u00e7\u00e3o de BGA, pelo que n\u00e3o \u00e9 necess\u00e1rio pr\u00e9-aquecimento durante o processo de dispensa\u00e7\u00e3o.Este adesivo \u00e9 uma excelente op\u00e7\u00e3o para processos que requerem uma temperatura de cura t\u00e3o baixa como 80\u00b0C. Clique aqui para consultar a ficha t\u00e9cnica do produto<\/p>","protected":false},"author":1,"featured_media":0,"comment_status":"open","ping_status":"closed","template":"","meta":{"_et_pb_use_builder":"","_et_pb_old_content":"","_et_gb_content_width":"","footnotes":""},"project_category":[33],"project_tag":[],"class_list":["post-439","project","type-project","status-publish","hentry","project_category-underfills"],"_links":{"self":[{"href":"https:\/\/produtronica.com\/en\/wp-json\/wp\/v2\/project\/439","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/produtronica.com\/en\/wp-json\/wp\/v2\/project"}],"about":[{"href":"https:\/\/produtronica.com\/en\/wp-json\/wp\/v2\/types\/project"}],"author":[{"embeddable":true,"href":"https:\/\/produtronica.com\/en\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/produtronica.com\/en\/wp-json\/wp\/v2\/comments?post=439"}],"version-history":[{"count":2,"href":"https:\/\/produtronica.com\/en\/wp-json\/wp\/v2\/project\/439\/revisions"}],"predecessor-version":[{"id":991,"href":"https:\/\/produtronica.com\/en\/wp-json\/wp\/v2\/project\/439\/revisions\/991"}],"wp:attachment":[{"href":"https:\/\/produtronica.com\/en\/wp-json\/wp\/v2\/media?parent=439"}],"wp:term":[{"taxonomy":"project_category","embeddable":true,"href":"https:\/\/produtronica.com\/en\/wp-json\/wp\/v2\/project_category?post=439"},{"taxonomy":"project_tag","embeddable":true,"href":"https:\/\/produtronica.com\/en\/wp-json\/wp\/v2\/project_tag?post=439"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}