{"id":440,"date":"2023-03-06T17:24:02","date_gmt":"2023-03-06T17:24:02","guid":{"rendered":"https:\/\/produtronica.com\/?post_type=project&#038;p=440"},"modified":"2023-07-04T23:12:33","modified_gmt":"2023-07-04T23:12:33","slug":"alpha-hitech-cu11-3127-underfill","status":"publish","type":"project","link":"https:\/\/produtronica.com\/en\/project\/alpha-hitech-cu11-3127-underfill\/","title":{"rendered":"ALPHA\u00ae\u00a0HiTech CU11-3127 Underfill"},"content":{"rendered":"<p>ALPHA\u00ae HiTech CU11-3127 Underfill is a one-component capillary underfill for protecting assembled chip packages on printed circuit boards. Its high Tg, low CTE properties protects the solder joints from mechanical stresses.<br>ALPHA HiTech CU11-3127 has a unique low viscosity property, making it possible to secure full coverage flow at room temperature without preheat. For a faster flow rate, preheat of &lt; 80\u00b0C is recommended on substrates during dispensing process.<\/p>\n\n\n\n<p><strong><a href=\"https:\/\/produtronica.com\/wp-content\/uploads\/2023\/03\/ALPHA-HiTech-CU11-3127-Adhesive-EN-23Mar21-TB.pdf\" data-type=\"URL\" target=\"_blank\" rel=\"noreferrer noopener\">Click here to see technical bulletin<\/a><\/strong><\/p>","protected":false},"excerpt":{"rendered":"<p>ALPHA\u00ae&nbsp;HiTech CU11-3127 Underfill \u00e9 um subenchimento capilar de um s\u00f3 componente para proteger as embalagens de chips montados em placas de circuito impresso. As suas propriedades de Tg elevada e CTE baixo protegem as juntas de solda contra tens\u00f5es mec\u00e2nicas.ALPHA HiTech CU11-3127 tem uma propriedade \u00fanica de baixa viscosidade, tornando poss\u00edvel garantir a cobertura total \u00e0 temperatura ambiente sem pr\u00e9-aquecimento. Para uma dispers\u00e3o mais r\u00e1pida, recomenda-se o pr\u00e9-aquecimento de &lt; 80\u00b0C nos substratos durante o processo de distribui\u00e7\u00e3o. Clique aqui para consultar a ficha t\u00e9cnica do produto<\/p>","protected":false},"author":1,"featured_media":0,"comment_status":"open","ping_status":"closed","template":"","meta":{"_et_pb_use_builder":"","_et_pb_old_content":"","_et_gb_content_width":"","footnotes":""},"project_category":[33],"project_tag":[],"class_list":["post-440","project","type-project","status-publish","hentry","project_category-underfills"],"_links":{"self":[{"href":"https:\/\/produtronica.com\/en\/wp-json\/wp\/v2\/project\/440","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/produtronica.com\/en\/wp-json\/wp\/v2\/project"}],"about":[{"href":"https:\/\/produtronica.com\/en\/wp-json\/wp\/v2\/types\/project"}],"author":[{"embeddable":true,"href":"https:\/\/produtronica.com\/en\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/produtronica.com\/en\/wp-json\/wp\/v2\/comments?post=440"}],"version-history":[{"count":2,"href":"https:\/\/produtronica.com\/en\/wp-json\/wp\/v2\/project\/440\/revisions"}],"predecessor-version":[{"id":990,"href":"https:\/\/produtronica.com\/en\/wp-json\/wp\/v2\/project\/440\/revisions\/990"}],"wp:attachment":[{"href":"https:\/\/produtronica.com\/en\/wp-json\/wp\/v2\/media?parent=440"}],"wp:term":[{"taxonomy":"project_category","embeddable":true,"href":"https:\/\/produtronica.com\/en\/wp-json\/wp\/v2\/project_category?post=440"},{"taxonomy":"project_tag","embeddable":true,"href":"https:\/\/produtronica.com\/en\/wp-json\/wp\/v2\/project_tag?post=440"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}