{"id":797,"date":"2023-03-12T15:15:38","date_gmt":"2023-03-12T15:15:38","guid":{"rendered":"https:\/\/produtronica.com\/?post_type=project&#038;p=797"},"modified":"2023-11-21T21:30:06","modified_gmt":"2023-11-21T21:30:06","slug":"solda-em-pasta-alpha-om338t","status":"publish","type":"project","link":"https:\/\/produtronica.com\/en\/project\/solda-em-pasta-alpha-om338t\/","title":{"rendered":"ALPHA\u00ae OM-338-T Solder Paste"},"content":{"rendered":"<p>ALPHA OM-338-T is a lead-free, no-clean solder paste designed for a broad range of applications. ALPHA OM-338-T\u2019s broad processing window is designed to minimize transition concerns from tin\/lead to lead free solder paste. This material is engineered to deliver the comparable performance to a tin lead process. ALPHA OM-338-T yields excellent print capability performance across various board designs and, particularly, with ultra fine feature repeatability (11 mil Squares) and high throughput applications.<br>Outstanding reflow process window delivers good soldering on CuOSP with excellent coalescence on a broad range of deposit sizes, excellent random solder ball resistance and mid-chip solder ball performance. ALPHA OM-338-T is formulated to deliver exceptional visual joint cosmetics. Additionally, ALPHA OM-338-T\u2019s capability of IPC Class III for voiding and ROL0 IPC classifications ensures maximum long-term product reliability. ALPHA OM-338-T is also known as ALPHA OM-338 with M13 viscosity.<\/p>\n\n\n\n<p><strong><a href=\"https:\/\/produtronica.com\/wp-content\/uploads\/2023\/03\/ALPHA-OM-338-T-Solder-Paste-EN-08Apr22-TB.pdf\" data-type=\"URL\" target=\"_blank\" rel=\"noreferrer noopener\">Click here to see technical bulletin<\/a><\/strong><\/p>","protected":false},"excerpt":{"rendered":"<p>ALPHA OM-338-T \u00e9 uma solda em pasta sem chumbo, no-clean, concebida para uma vasta gama de aplica\u00e7\u00f5es. A solda em pasta ALPHA OM-338-T \u00e9 concebida para minimizar as preocupa\u00e7\u00f5es da transi\u00e7\u00e3o de solda em pasta com estanho\/chumbo para solda em pasta sem chumbo.Este material foi concebido para proporcionar o desempenho compar\u00e1vel a um processo de estanho\/chumbo. ALPHA OM-338-T produz excelente desempenho da capacidade de impress\u00e3o em v\u00e1rios desenhos e, particularmente, com repetibilidade de caracter\u00edsticas ultra-finas (11 mil squares) e aplica\u00e7\u00f5es de alto rendimento. Clique aqui para consultar a ficha t\u00e9cnica do produto<\/p>","protected":false},"author":1,"featured_media":0,"comment_status":"open","ping_status":"closed","template":"","meta":{"_et_pb_use_builder":"off","_et_pb_old_content":"","_et_gb_content_width":"","footnotes":""},"project_category":[9],"project_tag":[],"class_list":["post-797","project","type-project","status-publish","hentry","project_category-sem-chumbo-sac"],"_links":{"self":[{"href":"https:\/\/produtronica.com\/en\/wp-json\/wp\/v2\/project\/797","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/produtronica.com\/en\/wp-json\/wp\/v2\/project"}],"about":[{"href":"https:\/\/produtronica.com\/en\/wp-json\/wp\/v2\/types\/project"}],"author":[{"embeddable":true,"href":"https:\/\/produtronica.com\/en\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/produtronica.com\/en\/wp-json\/wp\/v2\/comments?post=797"}],"version-history":[{"count":3,"href":"https:\/\/produtronica.com\/en\/wp-json\/wp\/v2\/project\/797\/revisions"}],"predecessor-version":[{"id":1232,"href":"https:\/\/produtronica.com\/en\/wp-json\/wp\/v2\/project\/797\/revisions\/1232"}],"wp:attachment":[{"href":"https:\/\/produtronica.com\/en\/wp-json\/wp\/v2\/media?parent=797"}],"wp:term":[{"taxonomy":"project_category","embeddable":true,"href":"https:\/\/produtronica.com\/en\/wp-json\/wp\/v2\/project_category?post=797"},{"taxonomy":"project_tag","embeddable":true,"href":"https:\/\/produtronica.com\/en\/wp-json\/wp\/v2\/project_tag?post=797"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}