ALPHA® Argomax® 8035 Film is a low-pressure silver sintering die attach film from Alpha. It is specially designed for application at wafer level and is particularly suited for high volume die attach of power discrete on leadframes.
Specifically designed as a film solution for wafer lamination for die attach onto bare copper surfaces, ALPHA® Argomax® 8035 innovative film provides a solution at the wafer level, providing customers with die pre-laminated with ALPHA® Argomax®.
Processing (lamination, dicing, pick-up) of ALPHA® Argomax® 8035 may vary based on die size, wafer thickness and type etc.
