ALPHA CVP-520 is designed for near eutetic low temperature alloys such as SnBi0.4Ag to enable peak reflow profiles between 155°C and 190°C. The flux residue is clear, colorless, and provides excellent electrochemical reliability.
The carefully selected alloy in ALPHA CVP-520 offers the lowest melting point, lowest pasty range during melting and re-solidification, offering maximum resistance to thermal cycle based fatigue in traditional low temperature alloy applications. The alloy also yields very low voiding BGA solder joints, even when a traditional SAC alloy sphere is used.
All components used with SnBi solders must be lead-free to eliminate the formation of tin/lead/bismuth intermetallic which has a melting point under 100°C.
