ALPHA® JP-500 is formulated to deliver excellent visual joint cosmetics and is rated ROL0 per IPC J-STD-004. ALPHA® JP-500 features a rheology capable of standard dispensing or jetting.
This paste is formulated to offer best-in-class in circuit pin test yields and high electrochemical reliability. ALPHA® JP-500 offers outstanding reflow process window and solderability across all traditional surface finishes.
