The low temperature, lead-free alloy in ALPHA® JP-501 has a melting point of 138°C, and has been successfully used with peak reflow profiles between 155 and 190°C. The flux residue from ALPHA® JP-501 is clear and colorless and is formulated to offer high electrical reliability in a zero halogen flux formulation.
ALPHA® JP-501 offers an outstanding reflow process window across all traditional surface finishes and is rated ROL0 per IPC J-STD-004. All components used with SnBi solders must be lead-free to eliminate the formation of tin/lead/bismuth intermetallic which has a melting point under 100°C.
