ALPHA® OM-372 is engineered specifically to address the challenges of extreme miniaturization in mobile, wearable, and computing markets. ALPHA® OM-372 provides best-in-class performance on low standoff components that require superior electrochemical performance and excellent transfer efficiency on fine feature sizes.
ALPHA® OM-372 is formulated to deliver more than 50% lower post reflow residue when compared to standard no clean pastes and is engineered for greater than 90% transfer efficiency on ultra-fine feature pad sizes as low as 80x130µm (008004).
ALPHA® OM-372 offers best-in-class electrochemical reliability on fine pitched, low standoff components under the most challenging conditions common to ultra-high density board designs.
