ALPHA® OM-5300 is a zero halogen, no clean solder paste developed to meet the demands of tin lead soldering when lead free components are present in the circuit assembly. ALPHA® OM-5300 provides excellent print volume repeatability and minimizes print cycle time by enabling high print speeds and extended number of prints between stencil undercleaning.
ALPHA® OM-5300 is capable of withstanding long, hot soak reflow profiles, allowing better wetting of lead free surfaces with tin lead paste alloy. Excellent BGA voiding and high post reflow SIR performance makes ALPHA® OM-5300 ideal for tin lead soldering when lead free components are used.
