ALPHA® OM-550 HRL1 is a high reliability, low-temperature solder paste. The HRL1 alloy in this paste has a melting point significantly lower than SAC305 which will help to increase production yield and reduce component warpage.
Together, the flux and alloy combine to make a product that has the characteristics of a traditional solder paste used in high end CPUs but with the ability to reflow at lower temperatures therefore minimizing post reflow warpage induced defects.
