ALPHA® OM-565 HRL3 low temperature solder paste is designed to mitigate warpage induced defects in temperature sensitive chip-scale packages. The solder paste enables peak reflow temperatures of 175 °C and superior wettability to minimize post reflow defects such as Non-Wet-Open (NWO) and Head-in-Pillow (HIP).
The ALPHA® OM-565 chemistry enhances electrochemical performance over existing low melt point solders and provides excellent compatibility when used in combination with alternative ALPHA solutions for contact rework applications.
