ALPHA® OM-338-PT is a lead-free, no-clean solder paste designed for a broad range of applications. ALPHA® OM-338-PT’s broad processing window is designed to minimize transition concerns from tin/lead to lead free solder paste. This material is engineered to deliver the comparable performance to a tin lead process. ALPHA® OM-338-PT yields excellent print capability performance across various board designs; particularly with ultra fine feature repeatability (11 mil squares) and high “through-put” applications. ALPHA® OM-338-PT is formulated to offer increased in-circuit pin test yields versus OM-338 without compromising electrical reliability.
Outstanding reflow process window delivers good soldering on CuOSP with excellent coalescence on a broad range of deposit sizes, excellent random solder ball resistance and mid-chip solder ball performance. ALPHA® OM-338-PT is formulated to deliver excellent visual joint cosmetics. Additionally, ALPHA® OM-338-PT’s capability of IPC Class III for voiding and ROL0 IPC classifications ensures maximum long-term product reliability.
