ALPHA OM-338-T is a lead-free, no-clean solder paste designed for a broad range of applications. ALPHA OM-338-T’s broad processing window is designed to minimize transition concerns from tin/lead to lead free solder paste. This material is engineered to deliver the comparable performance to a tin lead process. ALPHA OM-338-T yields excellent print capability performance across various board designs and, particularly, with ultra fine feature repeatability (11 mil Squares) and high throughput applications.
Outstanding reflow process window delivers good soldering on CuOSP with excellent coalescence on a broad range of deposit sizes, excellent random solder ball resistance and mid-chip solder ball performance. ALPHA OM-338-T is formulated to deliver exceptional visual joint cosmetics. Additionally, ALPHA OM-338-T’s capability of IPC Class III for voiding and ROL0 IPC classifications ensures maximum long-term product reliability. ALPHA OM-338-T is also known as ALPHA OM-338 with M13 viscosity.
