ALPHA® OM-345 is a lead-free, halogen free, no-clean solder paste designed for a broad range of applications. ALPHA® OM-345’s broad processing window is designed to minimize transition concerns from tin/lead to lead free solder paste. This material is engineered to deliver lead free solder with a very high level of electrical reliability. ALPHA® OM-345 yields excellent print capability performance across various board designs and, particularly, with ultra fine feature repeatability (11 mil Squares) and high “through-put” applications. Outstanding reflow process window delivers good soldering on CuOSP with excellent coalescence on a broad range of deposit sizes, excellent random solder ball resistance and mid-chip solder ball performance. Additionally, ALPHA® OM-345’s capability of IPC Class III for voiding and ROL0 IPC classifications ensures maximum long-term product reliability.
