ALPHA® TrueHeight® Preforms contain embedded bondline control wires that maintain a minimum bondline of the solder joint after reflow, ensuring solder joint reliability.
Multiple bondline control mechanisms can be included in a single solder preform to prevent tilt while ensuring a minimum bondline for applications such as warped substrate soldering.
These preforms are available in a wide range of sizes, suitable for clip attach, as well as substrate and heat spreader attach applications.
